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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

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Shenzhen Wenzhan Electronic Technology Co., Ltd.

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High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

Brand Name : WZ

Model Number : WZ-GX01

Place of Origin : China

MOQ : 1 set/sets

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal, Credit card

Supply Ability : 5000

Delivery Time : 5-8 days

Product name : die bonding machine

Solid crystal cycle : >40 ms

Dispensing heating : constant temperature

Resolution : 0.5 um

Fetching pressure : 20-200g

Power : 1.3 KW

Weight : 1040

Dimension(L*W*H) : 1545*1080*1715 mm

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Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder

Product name	die bonding machine
Solid crystal cycle	>40 ms
Die bonding position accuracy	±0.3 mil
Dispensing heating	constant temperature
Resolution	0.5 um
Chip ring size	6 inch
Image identification	256 gray scale
Fetching pressure	20-200 g
Frequency	50 HZ
Dimension(LWH)	154510801715 mm
Weight	1040
Voltage	220 V
Power	1.3 KW

Wafer Stage System

The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y

platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with

servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.

Feeding and Receiving System

The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the

precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked

according to actual needs, and the left and right material boxes can be quickly switched.

Imaging system

The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel

and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and

the Z-axis adjustment platform controls the focal length adjustment.

Swing arm system

The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the

swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation

and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and

stability.

Operating system

It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth

operation, which is in line with the operation habits of Chinese people.

High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine

Product Tags:

High Precision Semiconductor Packaging Equipment

LED Die Bonder Die Bonding Machine

High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine Images

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